深南电路(002916) 2024年业绩高增，Q4产品结构调整及载板业务拖累利润，维持“买入”评级2024年公司实现营业收入179.07亿元，yoy+32.39%，实现归母净利润18.78亿元，yoy+34.29%，实现扣非归母净利润17.40亿元，yoy+74.34%，公司在政府补助同比减少3亿的情况下实现了业绩的高增。单Q4，公司实现营收48.58亿元，yoy+19.51%，qoq+2.74%；实现归母净利润3.90亿元，yoy-20.50%，qoq-22.22%；实现毛利率21.95%，yoy-2.23pct，qoq-3.44pct；实现净利率8.04%，yoy-4.00pct，qoq-2.55pct。Q4由于产品结构调整以及载板需求、工厂产能爬坡、金价上涨等影响，利润率同环比略有下降。基于公司AI客户导入顺利以及ABF载板放量节奏，我们上调2025、2026年利润预期，新增2027年利润预期，预计2025-2027年归母净利润为26.08/32.76/38.49亿元（原值为24.89/29.78亿元），EPS为5.08/6.39/7.50元，当前股价对应PE为25.0/19.9/16.9倍，维持“买入”评级。 2024年PCB在AI、汽车等带动下营收利润双增，载板在2024H2承压分业务类型，2024年公司PCB/封装基板/电子装联分别实现营收104.94/31.71/28.23亿元，同比分别+29.99%/+37.49%/+33.20%；毛利率同比分别+5.07pct/-5.72pct/-0.26pct。PCB业务稼动率显著提升，数据中心及高速交换机、光模块需求显著增长，营收和利润率同步提升。载板业务客户拓展和项目导入顺利，营收显著增长，但是广州封装基板项目产能爬坡对整体利润率造成负向影响。电子装联业务在数据中心及汽车电子领域需求增长的背景下仍然稳定增长。 2025年重点关注“AI PCB”、ABF载板放量情况以及BT载板需求恢复情况PCB方面，2025年需求重点在AI及汽车领域，重点关注国内及海外AI客户的订单释放节奏；ABF载板方面，2025年公司广州封装基板处于产能爬坡关键时期，重点关注订单放量情况以及盈亏平衡点；BT载板方面，2025年需要关注存储等市场需求的恢复情况，同时关注工厂稼动率水平。 风险提示：下游需求不景气；竞争加剧影响盈利能力；客户导入节奏不及预期。

     深南电路(002916) Shennan released its FY24 results. Revenue went up by 32.4% YoY toRMB17.9bn, 2%/7% above our estimate/BBG consensus. Net profit rose by34.3% YoY to RMB1.9bn, in-line with our estimate but 2% below BBG consensus.During the period, GPM was 24.8% (vs. 23.4% in FY23), showing gradualimprovement as demand recovered but offset by new factory ramp-up. We reviseup our revenue forecasts by 15%/21% for FY25/26E, reflecting 1) higherutilization (~90% for 1Q), 2) higher-than-expected DC/AI-related revenue asdomestic Cloud companies increase capex budget and 3) better auto PCBrevenue growth as high-end autonomous driving systems may have faster-thananticipated penetration. Meanwhile, we revise up our NP estimates by 12%/16%in FY25-26E, partially offset by lower GPM estimates considering the continuouscapacity ramp-up of Guangzhou factory with costs from equipment, labor and rawmaterials now recognized in COGS as production ramps up. Upgrade to BUY,with new TP of RMB146.81 (previous: RMB115), implying a NP CAGR of 28.5%and PEG of 1.1x during 2024-26E. PCB sales grew by 30% YoY to RMB10.5bn, driven by robust demand indata centers (20% YoY) and auto (~14% of total sales), despite a telecomdecline (contributing to less than 40% of total PCB sales in FY24). PCB GPMimproved to 31.6% in FY24, compared to 26.6% in FY23, reflecting highercapacity utilization and an enhanced product mix consisting of more AIrelated products. PCBA segment increased by 33.2% YoY, also driven byrobust data center and auto sales, with a stable GPM of 14.4%. We expectthe segment revenue to grow 25% YoY in 2025, driven by strong growth inDC/auto markets (domestic AI capex and higher penetration of autonomousdriving vehicles). We project GPM will be stable at current ~31% level. Substrate sales grew by 37.5% YoY to RMB3.2bn. The growth weightedmore towards 1H24 as demand was strong due to inventory restockingbehaviors. The segment experienced margin pressure (18.2% in FY24 vs.23.9% in FY23) due to capacity ramp-up, rising material costs (specificallygold price, which surged by more than 20% in 2H24, per mgmt.), and weakerBT substrate demand in 2H24. Excluding the impact of the initial capacityramp-up of Guangzhou factory, BT substrate’s GPM in 2H would have been2ppts lower compared to 1H (instead of 10ppts drop). We expect substraterevenue to grow by 18% YoY in 2025E, led by higher growth in memoryproducts as demand recovers. GPM may rise modestly to 19.5%, consideringthe ongoing ramp-up dilution, in our view. Upgrade to BUY, with new TP of RMB146.81. The new TP is based on 5-year avg. historical forward PE of 31.0x. We believe SCC performed betterthan expected during the sectoral downcycle. Looking forward, the companyis set to ride the tailwind of domestic localization with its leading position inPCB market and capacity addition from its FC-BGA substrate line.

     深南电路(002916) 公司发布2024年年报，2024年公司实现业绩高增，公司PCB业务充分把握结构性机会，封装基板业正加快推动高端产品导入，维持买入评级。 支撑评级的要点 2024年公司持续加大各业务市场开发力度，推动产品结构进一步优化，业绩实现高增。公司2024年全年实现收入179.07亿元，同比+32.39%，实现归母净利润18.78亿元，同比+34.29%，实现扣非归母净利润17.40亿元，同比+74.34%。单季度来看，公司24Q4实现营收48.58亿元，同比+19.51%/环比+2.74%，实现归母净利润3.90亿元，同比-20.50%/环比-22.22%，实现扣非归母净利润3.64亿元，同比+39.50%/环比-22.93%。盈利能力方面，公司2024年毛利率24.83%，同比+1.40pcts，归母净利率10.48%，同比+0.15pct，扣非归母净利率9.72%，同比+2.34pcts。单季度来看，公司2024Q4实现毛利率21.95%，同比-2.23pcts/环比-3.44pcts，归母净利率8.02%，同比-4.04pcts，扣非归母净利率7.49%，同比+1.07pcts。 PCB充分把握AI算力及汽车电子市场机遇，营收稳健增长。公司2024年PCB实现营收104.94亿元，同比+29.99%，毛利率31.62%，同比+5.07pcts。1）通信领域：得益于高速交换机、光模块产品需求增长，有线侧通信产品占比提升，盈利能力有所改善；2）数据中心：受益于AI服务器相关需求增长及行业周期性回暖，数据中心业务已成为PCB业务继通信领域后第二个达20亿元级订单规模的下游市场；3）汽车电子公司汽车电子订单增速连续第三年超50%，前期导入的新客户定点项目需求释放，ADAS相关产品需求稳步增长。 封装基板业务聚焦能力建设与市场开发，推动新产品持续导入。公司封装基板业务实现营收31.71亿元，同比+37.49%，毛利率18.15%，同比-5.72pcts。1）当期归因：封装基板业务毛利率同比下降，主要系广州封装基板项目爬坡、金盐等部分原材料涨价叠加下半年BT类基板市场需求波动、产能利用率有所下降等因素综合影响。2）能力建设：BT基板方面，存储类产品成功推动客户新一代高端DRAM产品项目的导入及后续稳定量产；处理器芯片类产品，实现了基于WB工艺的大尺寸制造能力突破和FC-CSP类工艺技术能力提升；RF射频类产品，稳步推进新客户新产品导入，完成了主要客户的认证审核。FC-BGA封装基板方面，公司已具备16层及以下产品批量生产能力，18、20层产品具备样品制造能力，各阶产品相关送样认证工作有序推进。3）新项目：无锡基板二期已实现单月盈亏平衡。广州封装基板项目产品线能力快速提升产能爬坡稳步推进，已承接包括BT类及部分FC-BGA产品的批量订单，但总体尚处于产能爬坡早期阶段，成本及费用增加，对公司利润造成一定负向影响。 估值 考虑AI及汽车电子驱动公司PCB结构持续优化，国产算力需求提升，封装基板景气度或有望修复，新建项目能力持续优化。我们调整公司盈利预测，预计公司2025/2026/2027年分别实现收入213.31/249.61/290.39亿元，实现归母净利润分别为27.32/31.95/35.77亿元，EPS分别为5.33/6.23/6.97元，对应2025-2027年PE分别为23.9/20.4/18.2倍。公司仍具性价比，维持买入评级。 评级面临的主要风险 封装基板产能爬坡不及预期、AI及汽车等领域需求不及预期、新产品导入不及预期、国产互联网厂商采购国产供应链不积极。